Harnessing the Power of Chiplet-Based Architecture in Semiconductor Design
As the semiconductor industry progresses, scaling down traditional monolithic chips has become increasingly challenging. With Moore’s Law slowing, alternative strategies are needed to maintain performance gains and address rising design complexity. One of the most promising solutions is chiplet-based architecture.Chiplets are connected using advanced packaging technologies and high-bandwidth interconnects, such as 2.5D or 3D packaging. These interconnects enable efficient communication and data transfer between the individual chipsets.